Mitech XXG2005 Inflatable X-ray Flaw Detector

Mitech XXG2005 Inflatable X-ray Flaw Detector
Brand: Mitech

Product Overview

The Mitech XXG2005 is a high-performance inflatable X-ray flaw detector designed for non-destructive testing (NDT) across a wide range of industries. This portable system leverages the differential absorption of X-rays through materials of varying thickness to detect internal defects such as cracks, voids, and inclusions in metal components and welded joints.

Built for reliability and portability, the XXG2005 features a compact and lightweight design, making it especially suitable for field operations in harsh environments, including high altitudes and confined spaces. The system produces high-definition X-ray images on film, allowing for accurate visualization of internal flaws. These images can be preserved for long-term records and analysis.

Key Features

• Portable & Lightweight: Ideal for field inspections, even in difficult environments.

• Microcomputer Control: Ensures precise operation and simplifies the interface.

• Temperature Protection: Automatically shuts off high-voltage output to prevent damage to the X-ray tube during overheating.

• Stable Output: Independent mA and kV regulation systems for consistent radiation performance.

• Anti-interference Circuitry: Reduces the impact of high-voltage impulses on the control system.

• Comprehensive Fault Display: Error codes for quick identification of system issues.

• Delayed Start Function: Allows safe distancing of the operator before high voltage activation.

• Specialized Design: Isolated control and high-voltage circuits for enhanced operational safety.

• Versatile Power Compatibility: Equipped with functions for fluctuating generator voltage environments.

Technical Specifications

• Working Temperature: -25℃ to +40℃

• Relative Humidity: ≤ 85%

• Safe Operating Pressure: 0.35–0.50 MPa (Do not use under 0.35 MPa)

• Package Dimensions:

  • Box 1: 40.5 × 40 × 72.5 cm

  • Box 2: 47 × 47 × 33 cm

• Total Weight: 45–80 kg
  (Including all components and packaging)

Other parameters like measuring range, resolution, accuracy, communication, and storage are model-dependent. Please contact Mitech for specific configurations.

Applications

The XXG2005 is suitable for a wide variety of industries, including:

• Shipbuilding

• Machinery and metal fabrication

• Aerospace and aviation

• Railways

• Pressure vessels and boiler inspections

• Oil and gas pipelines

• Petrochemical and chemical industries

• Military and defense sectors

It is particularly effective in construction sites and high-altitude scenarios where conventional flaw detection tools may be less practical.

Working Principle

The detector generates high-voltage X-rays that pass through materials and expose special X-ray film. Defects within the material block or attenuate the rays differently, producing contrast on the film. The resulting image is processed through traditional developing and fixing methods, revealing internal flaws based on size, shape, and density.

The system utilizes a silicon-controlled rectifier (SCR) and pulse transformer to convert AC into high-voltage DC pulses. These are applied to a two-stage X-ray tube, accelerating electrons from cathode to anode, resulting in X-ray emission upon collision.

Operation Guide

1. Power On: Activates the control system, cooling fan, and warning indicators.

2. Set Exposure Time: Use the control knob to set the desired exposure.

3. Warm-up: Perform preheating to improve vacuum stability in the tube.

4. Set kV Level: Adjust to the required voltage based on the material and application.

5. Start Exposure: Press “HV” to begin X-ray generation; system will count down exposure time.

6. Cooling Cycle: After exposure, the unit enters a rest period to cool.

Delayed Start Option: Hold “HV” key for 3 seconds to activate delay mode (0.1 to 5 minutes), allowing time to exit the radiation area safely.

Safety Notes

• Radiation Protection: Always use proper shielding (e.g., 2mm lead plate) or maintain a 20-meter safety radius.

• Air Pressure Monitoring: Do not operate under 0.35 MPa.

• Grounding: Ensure proper earthing of the control unit to prevent electric shock.

• Power Stability: Do not cut power during rest cycles to allow the fan to cool the unit properly.

• Film Use: Only use dedicated X-ray film and lead foil screens for accurate imaging.